Invention Grant
- Patent Title: Solder ball attachment ring and method of use
- Patent Title (中): 焊球安装环及使用方法
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Application No.: US11946056Application Date: 2007-11-28
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Publication No.: US07985672B2Publication Date: 2011-07-26
- Inventor: Poh Leng Eu , Lan Chu Tan , Cheng Qiang Cui
- Applicant: Poh Leng Eu , Lan Chu Tan , Cheng Qiang Cui
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.
Public/Granted literature
- US20090134207A1 SOLDER BALL ATTACHMENT RING AND METHOD OF USE Public/Granted day:2009-05-28
Information query
IPC分类:
