Invention Grant
US07985680B2 Method of forming aluminum-doped metal carbonitride gate electrodes
有权
形成铝掺杂金属碳氮化物栅电极的方法
- Patent Title: Method of forming aluminum-doped metal carbonitride gate electrodes
- Patent Title (中): 形成铝掺杂金属碳氮化物栅电极的方法
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Application No.: US12197756Application Date: 2008-08-25
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Publication No.: US07985680B2Publication Date: 2011-07-26
- Inventor: Toshio Hasegawa , Gerrit J Leusink
- Applicant: Toshio Hasegawa , Gerrit J Leusink
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
A method for forming an aluminum-doped metal (tantalum or titanium) carbonitride gate electrode for a semiconductor device is described. The method includes providing a substrate containing a dielectric layer thereon, and forming the gate electrode on the dielectric layer in the absence of plasma. The gate electrode is formed by depositing a metal carbonitride film, and adsorbing an atomic layer of an aluminum precursor on the metal carbonitride film. The steps of depositing and adsorbing may be repeated a desired number of times until the aluminum-doped metal carbonitride gate electrode has a desired thickness.
Public/Granted literature
- US20100048009A1 METHOD OF FORMING ALUMINUM-DOPED METAL CARBONITRIDE GATE ELECTRODES Public/Granted day:2010-02-25
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