Invention Grant
- Patent Title: Thermoelectric module
- Patent Title (中): 热电模块
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Application No.: US12002154Application Date: 2007-12-14
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Publication No.: US07985918B2Publication Date: 2011-07-26
- Inventor: Joel Lindstrom
- Applicant: Joel Lindstrom
- Applicant Address: US NH Bedford
- Assignee: Thermohex, LLC
- Current Assignee: Thermohex, LLC
- Current Assignee Address: US NH Bedford
- Agency: Devine, Millimet & Branch
- Agent Paul C. Remus; Raymond I. Bruttomesso, Jr.
- Main IPC: H01L35/00
- IPC: H01L35/00 ; H01L37/00
Abstract:
A novel thermoelectric module in which the thermoelectric elements are stacked together with thermal and electrical conductors integrated in the stack to perform the dual functions of conducting both heat and electricity.
Public/Granted literature
- US20080142069A1 Thermoelectric module Public/Granted day:2008-06-19
Information query
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