Invention Grant
- Patent Title: Terminal crimping structure and terminal crimping method of crimping terminal to copper alloy wire and wire harness with the terminal crimping structure
- Patent Title (中): 端子压接结构和端子压接方法的压接端子与铜合金线和线束端子压接结构
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Application No.: US11969964Application Date: 2008-01-07
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Publication No.: US07985923B2Publication Date: 2011-07-26
- Inventor: Satoshi Yagi , Shigeharu Suzuki , Tetsuro Ide , Hideto Kumakura , Kenji Suzuki
- Applicant: Satoshi Yagi , Shigeharu Suzuki , Tetsuro Ide , Hideto Kumakura , Kenji Suzuki
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-013058 20070123
- Main IPC: H01R4/00
- IPC: H01R4/00
Abstract:
A terminal crimping structure includes a terminal crimped to a copper alloy wire. The terminal has a crimping piece portion crimped to the copper alloy core wire portion. A rate of compression of the copper alloy core wire portion, of a particular diameter, by the crimping piece portion is determined from a relative relation between a parameter varying according to the ratio of (the cross-sectional area of the copper alloy core wire portion at a crimped portion)/(the cross-sectional area of the copper alloy core wire portion before crimping) and a parameter varying according to the ratio of (a cross-sectional area of an annealed copper core wire portion at a crimped portion)/the cross-sectional area of the annealed copper core wire portion before crimping) which is the rate of compression of the annealed copper core wire portion by the crimping piece portion.
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