Invention Grant
- Patent Title: Enclosure for a connector
- Patent Title (中): 连接器外壳
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Application No.: US11980374Application Date: 2007-10-31
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Publication No.: US07985931B2Publication Date: 2011-07-26
- Inventor: Junichi Akama , Mitsuru Kobayashi
- Applicant: Junichi Akama , Mitsuru Kobayashi
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2007-159036 20070615
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H05K9/00
Abstract:
An enclosure for a connector is disclosed.The enclosure includes two or more enclosure parts, each having a joint such that the enclosure parts are fit together to constitute the enclosure. The joint may have a continuation of linear segments to form a shape like mountains, wherein the length of each segment is smaller than a wavelength corresponding to an operational frequency.
Public/Granted literature
- US20080310086A1 Enclosure for a connector Public/Granted day:2008-12-18
Information query
