Invention Grant
- Patent Title: Semiconductor light-emitting device and method of fabricating the same
- Patent Title (中): 半导体发光器件及其制造方法
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Application No.: US12834082Application Date: 2010-07-12
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Publication No.: US07985973B2Publication Date: 2011-07-26
- Inventor: Jen-Shyan Chen
- Applicant: Jen-Shyan Chen
- Applicant Address: BN Brunei Darussalam
- Assignee: Neobulb Technologies, Inc.
- Current Assignee: Neobulb Technologies, Inc.
- Current Assignee Address: BN Brunei Darussalam
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP.
- Priority: CN200510074731 20050531; CNPCT/CN2006/001165 20060531
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L27/15
Abstract:
The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.
Public/Granted literature
- US20100270565A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2010-10-28
Information query
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