Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12340027Application Date: 2008-12-19
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Publication No.: US07985985B2Publication Date: 2011-07-26
- Inventor: Akira Hokazono
- Applicant: Akira Hokazono
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-338047 20071227
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/76 ; H01L29/94

Abstract:
A semiconductor device according to one embodiment includes: a semiconductor substrate; a first impurity diffusion suppression layer formed on the semiconductor substrate for suppressing diffusion of a channel impurity; an impurity channel layer formed on the first impurity diffusion suppression layer and containing the channel impurity; a second impurity diffusion suppression layer formed on the impurity channel layer for suppressing diffusion of the channel impurity; a channel layer formed on the second impurity diffusion suppression layer; a gate insulating film formed on the channel layer; and a gate electrode formed on the gate insulating film.
Public/Granted literature
- US20090166685A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2009-07-02
Information query
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