Invention Grant
- Patent Title: Semiconductor device
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Application No.: US12654490Application Date: 2009-12-22
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Publication No.: US07986014B2Publication Date: 2011-07-26
- Inventor: Reika Ichihara , Yoshinori Tsuchiya , Masato Koyama , Akira Nishiyama
- Applicant: Reika Ichihara , Yoshinori Tsuchiya , Masato Koyama , Akira Nishiyama
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2005-036575 20050214
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
Public/Granted literature
- US20100171184A1 Semiconductor device Public/Granted day:2010-07-08
Information query
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