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US07986019B2 Solid-state imaging device and its manufacturing method 有权
固态成像装置及其制造方法

Solid-state imaging device and its manufacturing method
Abstract:
A solid-state imaging device includes a semiconductor substrate having a photoelectric conversion region, a first microlens provided above the semiconductor substrate, covering the photoelectric conversion region, and having a convex upper surface, for gathering external light into the photoelectric conversion region, and a second microlens provided above the first microlens and having a convex upper surface, for gathering external light into the first microlens. A flat surface is provided at a top portion of one of the first and second microlenses and immediately above the photoelectric conversion region.
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