Invention Grant
- Patent Title: Resin molding part and manufacturing method thereof
- Patent Title (中): 树脂成型部件及其制造方法
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Application No.: US12370999Application Date: 2009-02-13
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Publication No.: US07986031B2Publication Date: 2011-07-26
- Inventor: Mitsuaki Nakata , Tomonori Abe , Kosei Tsuji , Yuhei Awano , Kazuhiko Yamashita , Hideo Iinuma , Iwao Katsuno , Takayuki Inuzuka , Akihiro Fujita
- Applicant: Mitsuaki Nakata , Tomonori Abe , Kosei Tsuji , Yuhei Awano , Kazuhiko Yamashita , Hideo Iinuma , Iwao Katsuno , Takayuki Inuzuka , Akihiro Fujita
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-034421 20080215; JP2008-321462 20081217
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.
Public/Granted literature
- US20090206457A1 RESIN MOLDING PART AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-08-20
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