Invention Grant
US07986039B2 Wafer assembly comprising MEMS wafer with polymerized siloxane attachment surface
有权
晶圆组件包括具有聚合的硅氧烷附着表面的MEMS晶片
- Patent Title: Wafer assembly comprising MEMS wafer with polymerized siloxane attachment surface
- Patent Title (中): 晶圆组件包括具有聚合的硅氧烷附着表面的MEMS晶片
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Application No.: US12563956Application Date: 2009-09-21
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Publication No.: US07986039B2Publication Date: 2011-07-26
- Inventor: Gregory John McAvoy , Kia Silverbrook , Emma Rose Kerr , Misty Bagnat , Vincent Patrick Lawlor
- Applicant: Gregory John McAvoy , Kia Silverbrook , Emma Rose Kerr , Misty Bagnat , Vincent Patrick Lawlor
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
A wafer assembly comprises a wafer having a MEMS layer formed on a frontside and a polymer coating covering the MEMS layer. A holding means is releasably attached to the polymer coating so that the wafer assembly facilitates performance of backside operations on a backside of the wafer. The polymer coating is comprised of a polymerized siloxane.
Public/Granted literature
- US20100090296A1 WAFER ASSEMBLY COMPRISING MEMS WAFER WITH POLYMERIZED SILOXANE ATTACHMENT SURFACE Public/Granted day:2010-04-15
Information query
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