Invention Grant
- Patent Title: Method for fabrication of a semiconductor device and structure
- Patent Title (中): 半导体器件和结构的制造方法
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Application No.: US12849272Application Date: 2010-08-03
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Publication No.: US07986042B2Publication Date: 2011-07-26
- Inventor: Zvi Or-Bach , Brian Cronquist , Israel Beinglass , Jan Lodewijk de Jong , Deepak C. Sekar
- Applicant: Zvi Or-Bach , Brian Cronquist , Israel Beinglass , Jan Lodewijk de Jong , Deepak C. Sekar
- Applicant Address: US CA San Jose
- Assignee: MonolithIC 3D Inc.
- Current Assignee: MonolithIC 3D Inc.
- Current Assignee Address: US CA San Jose
- Agency: Venable LLP
- Agent Michael A. Sartori; Yao Wang
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/528 ; H01L21/98

Abstract:
A semiconductor device comprising: a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layers; wherein the second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands wherein each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.
Public/Granted literature
- US20100289064A1 METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE Public/Granted day:2010-11-18
Information query
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