Invention Grant
- Patent Title: Signal transmission arrangement and method
- Patent Title (中): 信号传输布置和方法
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Application No.: US11360982Application Date: 2006-02-23
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Publication No.: US07986044B2Publication Date: 2011-07-26
- Inventor: Roderick McConnell
- Applicant: Roderick McConnell
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Maginot, Moore & Beck
- Priority: DE102005008322 20050223
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Data signals are transmitted between a number of semiconductor chips which are connected to one another in a common chip package. For that a signal transmission arrangement is set up for a transmission of the signals via in each case one transmitting/receiving interface which is arranged at the chip ends of a power supply connection which connects the number of semiconductor chips.
Public/Granted literature
- US20060211380A1 Signal transmission arrangement and method Public/Granted day:2006-09-21
Information query
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