Invention Grant
US07986045B2 Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers
有权
半导体器件具有增加的一个相对电极部分的面积，用于防止在接合晶片上产生不连接位置的电极
- Patent Title: Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers
- Patent Title (中): 半导体器件具有增加的一个相对电极部分的面积，用于防止在接合晶片上产生不连接位置的电极
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Application No.: US12194672Application Date: 2008-08-20
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Publication No.: US07986045B2Publication Date: 2011-07-26
- Inventor: Takanori Maebashi , Nobuaki Miyakawa
- Applicant: Takanori Maebashi , Nobuaki Miyakawa
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
In this semiconductor device, connection parts between wafers are electrically insulated from each other, and a junction face shape of second electrical signal connection parts is larger than the shape of a positioning margin face that is formed by an outer shape when the periphery of a minimum junction face, which has half the area of a junction area of the first electrical signal connection part, is enclosed by a same width dimension as a positioning margin dimension between the first wafer and the second wafer.
Public/Granted literature
- US20090057890A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-03-05
Information query
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