Invention Grant
US07986050B2 Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
有权
用于光学半导体元件封装的环氧树脂组合物和使用其的光学半导体器件
- Patent Title: Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
- Patent Title (中): 用于光学半导体元件封装的环氧树脂组合物和使用其的光学半导体器件
-
Application No.: US12509764Application Date: 2009-07-27
-
Publication No.: US07986050B2Publication Date: 2011-07-26
- Inventor: Shinya Ota , Kazuhiro Fuke , Chisato Goto , Hisataka Ito , Takashi Taniguchi , Kazuhiko Yoshida , Masao Gunji , Seigou Takuwa
- Applicant: Shinya Ota , Kazuhiro Fuke , Chisato Goto , Hisataka Ito , Takashi Taniguchi , Kazuhiko Yoshida , Masao Gunji , Seigou Takuwa
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-193449 20080728; JP2008-193450 20080728; JP2009-122041 20090520
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/29
Abstract:
The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): (A) an epoxy resin represented by the following structural formula (1): in which n is a positive number, (B) an epoxy resin except for the epoxy resin represented by the structural formula (1), and (C) a curing agent.
Public/Granted literature
Information query
IPC分类:
