Invention Grant
- Patent Title: Surface mount magnetic component assembly
- Patent Title (中): 表面贴装磁性元件组件
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Application No.: US12429856Application Date: 2009-04-24
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Publication No.: US07986208B2Publication Date: 2011-07-26
- Inventor: Yipeng Yan , Robert James Bogert
- Applicant: Yipeng Yan , Robert James Bogert
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: Armstrong Teasdale LLP
- Main IPC: H01F27/29
- IPC: H01F27/29

Abstract:
A surface mount magnetic component assembly including a magnetic core having a side with a stepped external surface, a coil within the magnetic core, and terminal clips for making electrical connections to the ends of the coil. The ends of the coil extend through the stepped external surface, the terminal clips attach to the stepped external surface, and the external surface is mounted to a circuit board to complete electrical connection with improved reliability. Smaller component sizes with improved manufacturability and consistency result.
Public/Granted literature
- US20100007451A1 SURFACE MOUNT MAGNETIC COMPONENT ASSEMBLY Public/Granted day:2010-01-14
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