Invention Grant
- Patent Title: Distributing power to an integrated circuit
- Patent Title (中): 将功率分配给集成电路
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Application No.: US12457208Application Date: 2009-06-03
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Publication No.: US07986504B2Publication Date: 2011-07-26
- Inventor: Mikael Rien , Fabrice Blanc , Nidhir Kumar
- Applicant: Mikael Rien , Fabrice Blanc , Nidhir Kumar
- Applicant Address: GB Cambridge
- Assignee: ARM Limited
- Current Assignee: ARM Limited
- Current Assignee Address: GB Cambridge
- Agency: Nixon & Vanderhye P.C.
- Priority: IN557/DEL/2009 20090324
- Main IPC: H02H9/00
- IPC: H02H9/00

Abstract:
A power supply cell for distributing power supplied from a first voltage supply to an integrated circuit is disclosed. The power supply cell comprises: a layer comprising conductive material, the conductive material providing a conduction path for current flowing from the first voltage supply to a portion of the integrated circuit to be powered and further providing a protection path for surge current flowing between the first voltage supply and an electrostatic discharge protection device and between the electrostatic discharge protection device and the second voltage supply; the conductive material forming a first conduction path for providing a path for current flowing between the first voltage supply and the portion of the integrated circuit to be powered and for providing a portion of the protection path for surge current flowing between the first voltage supply and the electrostatic discharge protection device and a second conduction path for providing a further portion of the protection path for surge current flowing between the second voltage supply and the electrostatic discharge protection device; wherein the conductive material is arranged such that the first conduction path has a significantly lower resistance than the second conduction path.
Public/Granted literature
- US20100244564A1 Distributing power to an integrated circuit Public/Granted day:2010-09-30
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