According to one embodiment, an electronic device includes a printed wiring board, a first heat generating part and a second heat generating part secured to one surface of the printed wiring board, a plurality of first heat pipes, a second heat pipe and a heat sink. The first heat pipes each include a first end portion, a second end portion on an opposite side to the first end portion and a middle portion located between the first and second end portions and thermally connected to the first heat generating part. The second heat pipe includes a third end portion connected to the second end portion and a fourth end portion provided on an opposite side to the third end portion and thermally connected to the second heat generating part. The second heat pipe has a width dimension larger than that of the first heat pipe.