Invention Grant
- Patent Title: Cover releasing assembly and electronic device using the same
- Patent Title (中): 盖释放组件和使用其的电子装置
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Application No.: US12633085Application Date: 2009-12-08
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Publication No.: US07986524B2Publication Date: 2011-07-26
- Inventor: Shui-Jin Dong , Yu Zhang
- Applicant: Shui-Jin Dong , Yu Zhang
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agent Steven M. Reiss
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H04M1/00 ; A47B81/00

Abstract:
A electronic device includes a housing, a cover detachably mounted on the housing and a releasing assembly. The housing has a first surface and two latching hooks disposed on the first surface. The releasing assembly is mounted on the cover to assemble the cover to the housing and detach the cover from the housing. The releasing assembly includes a fixing base mounted on the cover, two latching pieces, an elastic piece and a releasing piece. The two latching pieces are slidably mounted on the fixing base and both includes a latching end exposing out of the fixing base. The elastic piece is elastically assembled to the fixing base to connect the two latching pieces together. The releasing piece is releasably assembled to the fixing base for releasably resisting on the two latching pieces to make the latching pieces release from the corresponding latching hooks.
Public/Granted literature
- US20100327712A1 COVER RELEASING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2010-12-30
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