A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.