Invention Grant
US07987014B2 Systems and methods for selecting wafer processing order for cyclical two pattern defect detection
有权
用于选择晶圆处理顺序的系统和方法,用于周期性两种模式缺陷检测
- Patent Title: Systems and methods for selecting wafer processing order for cyclical two pattern defect detection
- Patent Title (中): 用于选择晶圆处理顺序的系统和方法,用于周期性两种模式缺陷检测
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Application No.: US12120881Application Date: 2008-05-15
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Publication No.: US07987014B2Publication Date: 2011-07-26
- Inventor: Douglas Edmund Paradis
- Applicant: Douglas Edmund Paradis
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G06F7/00 ; H01L21/00

Abstract:
A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lot, where the wafer lot contains a number of slots and the fabrication equipments each includes a first subsystem for processing wafers in odd-numbered slots of the first wafer lot and a second subsystem for processing wafers in even-numbered slots of the first wafer lot, and where each of the generated wafer sequences contains exactly a number of wafer identifiers that match the wafer identifiers in every other wafer sequence indexed in the set.
Public/Granted literature
- US20090287338A1 SYSTEMS AND METHODS FOR SELECTING WAFER PROCESSING ORDER FOR CYCLICAL TWO PATTERN DEFECT DETECTION Public/Granted day:2009-11-19
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