Invention Grant
- Patent Title: Interfacing computer modules
- Patent Title (中): 接口电脑模块
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Application No.: US10172718Application Date: 2002-06-14
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Publication No.: US07987223B2Publication Date: 2011-07-26
- Inventor: Paul J Garnett , James E King , Martin P Mayhead , Peter Heffernan
- Applicant: Paul J Garnett , James E King , Martin P Mayhead , Peter Heffernan
- Applicant Address: US CA Redwood City
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood City
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Rory D. Rankin
- Main IPC: G06F15/16
- IPC: G06F15/16 ; H02B5/00 ; H02K5/00

Abstract:
An information processing module includes a processor subsystem including a processor and memory. The information processing module is configured as a field replaceable unit blade server removably receivable in a carrier. Redundant external connections are provided for interconnection with the carrier. The external connections for carry information signals, management signals and power. The information processing module can be configured as a field replaceable blade server. The provision of a limited set of redundant connections provides for highly reliable interconnection between the information processing module and the carrier.
Public/Granted literature
- US20030033364A1 Interfacing computer modules Public/Granted day:2003-02-13
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