Invention Grant
- Patent Title: Booting with sub socket partitioning
- Patent Title (中): 使用子插槽分区进行引导
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Application No.: US11948309Application Date: 2007-11-30
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Publication No.: US07987352B2Publication Date: 2011-07-26
- Inventor: Ajay Harikumar , Tessil Thomas , Biju P. Simon , Kiran S. Panesar
- Applicant: Ajay Harikumar , Tessil Thomas , Biju P. Simon , Kiran S. Panesar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: G06F15/177
- IPC: G06F15/177

Abstract:
A method of booting up a computer system comprising a first multi-cored processor comprising a first plurality of cores and a second multi-cored processor comprising a second plurality of cores is disclosed. The method may comprise configuring a first partition comprising a first one or more cores from the first plurality of cores and from the second plurality of cores, configuring a second partition comprising a second one or more cores from the first plurality of cores and from the second plurality of cores, and configuring a third partition comprising a third one or more cores from the first plurality of cores and one or more cores from the second plurality of cores.
Public/Granted literature
- US20090144531A1 BOOTING WITH SUB SOCKET PARTITIONING Public/Granted day:2009-06-04
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