Invention Grant
- Patent Title: Coupled pivoted acceleration sensors
- Patent Title (中): 联轴器加速度传感器
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Application No.: US12055965Application Date: 2008-03-26
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Publication No.: US07987716B2Publication Date: 2011-08-02
- Inventor: Leslie Bruce Wilner
- Applicant: Leslie Bruce Wilner
- Applicant Address: US CA San Juan Capistrano
- Assignee: Endevco Corporation
- Current Assignee: Endevco Corporation
- Current Assignee Address: US CA San Juan Capistrano
- Agency: Goodwin Procter LLP
- Agent Paul Davis
- Main IPC: G01P15/12
- IPC: G01P15/12

Abstract:
A pivoted acceleration sensor has a substrate that is substantially parallel to first and second surfaces. A reference frame is provided. A first unbalanced seismic mass is suspended within the reference frame and is coupled with the reference frame through first and second strain gauges. The first and second strain gauges are located along a pivot axis of the first unbalanced seismic mass. The first and second strain gauges are first and second piezoresistors on the first surface of the substrate, A second unbalanced seismic mass is flexibly coupled with the first unbalanced seismic mass. The second unbalanced seismic mass is suspended within the reference frame and is coupled with the reference frame through third and fourth strain gauges. The third and fourth strain gauges are located along a pivot axis of the second unbalanced seismic mass. The third and fourth strain gauges are third and fourth piezoresistors on the first surface of the substrate. Metallization on the first surface of the substrate is configured to connect the first, second, third and fourth piezoresistors in a bridge configuration without crossovers.
Public/Granted literature
- US20090241669A1 Coupled pivoted acceleration sensors Public/Granted day:2009-10-01
Information query
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