Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
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Application No.: US11833951Application Date: 2007-08-03
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Publication No.: US07987898B2Publication Date: 2011-08-02
- Inventor: Jin-Gong Meng , Ching-Bai Hwang
- Applicant: Jin-Gong Meng , Ching-Bai Hwang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology, Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology, Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Jeffrey T. Knapp
- Priority: CN200710076390 20070704
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20

Abstract:
A heat dissipation device includes a cooling fan (15) defining an air inlet and an air outlet (157) oriented perpendicular to the air inlet; a metal foam (11) is arranged in the air outlet of the cooling fan, and a heat pipe (13) has a condensing end (131) being thermally attached to the metal foam. The metal foam forms numerous open cells (118). A plurality of guiding holes (116) are defined in the metal foam facing to a rotor (153) of the cooling fan for an airflow generated by the cooling fan to flow therethrough. The guiding hole (116) has a size larger that that of the open cell (118). The guiding hole has an outer end opened to an outside of the cooling fan (15).
Public/Granted literature
- US20090008066A1 HEAT DISSIPATION DEVICE Public/Granted day:2009-01-08
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