Invention Grant
US07987968B2 Chip component carrying method and system, and visual inspection method and system
有权
芯片组件携带方法和系统,目视检查方法和系统
- Patent Title: Chip component carrying method and system, and visual inspection method and system
- Patent Title (中): 芯片组件携带方法和系统,目视检查方法和系统
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Application No.: US11578062Application Date: 2004-09-07
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Publication No.: US07987968B2Publication Date: 2011-08-02
- Inventor: Masayoshi Kobayashi , Toru Mizuno
- Applicant: Masayoshi Kobayashi , Toru Mizuno
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-117651 20040413
- International Application: PCT/JP2004/013284 WO 20040907
- International Announcement: WO2005/100215 WO 20051027
- Main IPC: B65G29/00
- IPC: B65G29/00

Abstract:
A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.
Public/Granted literature
- US20070205084A1 Chip Component Carrying Method and System, and Visual Inspection Method and System Public/Granted day:2007-09-06
Information query
IPC分类: