Invention Grant
- Patent Title: Holding apparatus
- Patent Title (中): 保持装置
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Application No.: US12052432Application Date: 2008-03-20
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Publication No.: US07988216B2Publication Date: 2011-08-02
- Inventor: You-En Ku , Huang-Ken Tai
- Applicant: You-En Ku , Huang-Ken Tai
- Applicant Address: TW Taoyuan
- Assignee: Inotera Memories, Inc.
- Current Assignee: Inotera Memories, Inc.
- Current Assignee Address: TW Taoyuan
- Priority: TW97104539A 20080205
- Main IPC: B65G49/07
- IPC: B65G49/07

Abstract:
A holding apparatus for holding a semiconductor wafer comprises a pneumatic cylinder, a plunger movably connected to the pneumatic cylinder, an inlet pipe connected to the pneumatic cylinder, and a relief valve connected to the inlet pipe. Clean dry air is pumped into the pneumatic cylinder through the inlet pipe to impel the plunger in a first direction to contact the wafer. A part of the air in the inlet pipe is discharged through the relief valve to regulate air pressure to the pneumatic cylinder.
Public/Granted literature
- US20090196718A1 HOLDING APPARATUS Public/Granted day:2009-08-06
Information query
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