Invention Grant
- Patent Title: Vacuum mold and device for drilling extraction holes therein
- Patent Title (中): 真空模具及其中的钻孔装置
-
Application No.: US12344655Application Date: 2008-12-29
-
Publication No.: US07988442B2Publication Date: 2011-08-02
- Inventor: Jiang Yu , Jian-Bin Deng , Yi Zhao , Bo Liu , Shao-Hui Zhang , Qing-Ming Yuan
- Applicant: Jiang Yu , Jian-Bin Deng , Yi Zhao , Bo Liu , Shao-Hui Zhang , Qing-Ming Yuan
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agent Clifford O. Chi
- Priority: CN200810302546 20080704
- Main IPC: B29C33/46
- IPC: B29C33/46
Abstract:
A vacuum mold includes a mold body with a molding surface. The mold body defines a plurality of extraction holes. Each extraction hole includes a first hole portion, a second hole portion, and a connecting portion connecting the first hole portion and second hole portion. The first hole portion is adjacent to the molding surface, and a diameter of the first hole portion is smaller than a diameter of the second hole portion.
Public/Granted literature
- US20100003092A1 VACUUM MOLD AND DEVICE FOR DRILLING EXTRACTION HOLES THEREIN Public/Granted day:2010-01-07
Information query
