Invention Grant
- Patent Title: Electrical connector assembly having reduced depth terminals
- Patent Title (中): 电连接器组件具有减小的深度端子
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Application No.: US12729958Application Date: 2010-03-23
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Publication No.: US07988457B1Publication Date: 2011-08-02
- Inventor: Chad William Morgan
- Applicant: Chad William Morgan
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00

Abstract:
An electrical connector assembly includes a circuit board having vias extending at least partially through the circuit hoard along parallel via axes. The circuit board includes electrical conductors exposed within corresponding vias that extend between a top and a bottom. The electrical connector assembly also includes an electrical connector mounted on the circuit board that includes a housing having a mounting face configured to be mounted along the circuit board, and a plurality of variable depth signal terminals held by the housing. The signal terminals each include mounting contacts extending outward from the mounting face of the housing that are received in respective vias of the circuit board. The mounting contacts extend different depths into respective vias of the circuit board to engage the corresponding electrical conductors. The mounting contacts have a mounting end arranged at substantially the same depth within the via as the bottom of the electrical conductor.
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