Invention Grant
US07988462B2 Electrical connector having high density contacts for miniaturization
有权
具有高密度触点的电连接器用于小型化
- Patent Title: Electrical connector having high density contacts for miniaturization
- Patent Title (中): 具有高密度触点的电连接器用于小型化
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Application No.: US12758716Application Date: 2010-04-12
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Publication No.: US07988462B2Publication Date: 2011-08-02
- Inventor: Yu-Hua Mao , Zhi-Hong Fang
- Applicant: Yu-Hua Mao , Zhi-Hong Fang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Priority: CN200910305427 20090810
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector includes an insulative housing (1) with a rear portion (11) and a front portion (12) along a first direction (A), a spacer (4) assembled on the rear portion (11) which has a plurality of first wedged positioning sections (42, 43) in an inner side thereof and arranged along a second direction (B) and a plurality of contacts (2) received in the insulative housing and comprising a soldering portion (203) extending out of the insulative housing. The spacer (4) includes a plurality of positioning grooves (45) in an external side thereof for receiving and positioning the soldering portions (203c) of one part contacts (23) located at an upper side of the front portion (12). The soldering portions (203a, 203b) of the other contacts (21a, 21b) are sandwiched between the spacer (4) and the rear portion (11) thereby forms a waved configuration.
Public/Granted literature
- US20110034088A1 ELECTRICAL CONNECTOR HAING HIGH DENSITY CONTACTS FOR MINIATURIZATION Public/Granted day:2011-02-10
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