Disclosed is an earphone jack including a housing, a circuit connector mounted in the housing, and a plurality of first connecting terminals each including a first connecting section outwardly protruded from the housing, to be connected to a circuit of an audio appliance, and a second connecting section extending from the first connecting section while being bent to have a C shape such that the second connecting section elastically fits around an associated one of the connecting terminals of the earphone plug. It is possible to elastically support the earphone plug even after the earphone plug is repeatedly inserted into and separated from the housing, because the first connecting terminals have a structure bent to have a circular shape.