Invention Grant
US07988501B2 IC socket with improved contact having deformable retention portion 有权
具有改进接触的IC插座具有可变形保持部分

  • Patent Title: IC socket with improved contact having deformable retention portion
  • Patent Title (中): 具有改进接触的IC插座具有可变形保持部分
  • Application No.: US12386630
    Application Date: 2009-04-21
  • Publication No.: US07988501B2
    Publication Date: 2011-08-02
  • Inventor: Chun-Yi Chang
  • Applicant: Chun-Yi Chang
  • Applicant Address: TW Taipei
  • Assignee: Hon Hai Precision Ind. Co., Ltd.
  • Current Assignee: Hon Hai Precision Ind. Co., Ltd.
  • Current Assignee Address: TW Taipei
  • Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
  • Priority: TW97206757U 20080421
  • Main IPC: H01R13/42
  • IPC: H01R13/42
IC socket with improved contact having deformable retention portion
Abstract:
An IC socket (1) for receiving an IC package includes an insulative housing (2) with a plurality of passageways (20) thereof and a plurality of contacts (3) mounted within the passageways (20) of the insulative housing (2) respectively. The contact (3) has a base section (30), an upward contact arm (31) and a downward contact arm (32) respectively extending from the base section (30), and a pair of retaining arms (33) extending from opposite sides of the base section (30). The retaining arm (33) includes an elastic section (330) engaging with an inner wall of the passageway (20) and an opening (332) adjacent to the elastic section (330).
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