Invention Grant
- Patent Title: Resin molding process and resin-molding mold device
- Patent Title (中): 树脂成型工艺和树脂成型模具装置
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Application No.: US12921511Application Date: 2009-03-10
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Publication No.: US07988904B2Publication Date: 2011-08-02
- Inventor: Yuuichirou Noda
- Applicant: Yuuichirou Noda
- Applicant Address: JP Miyazaki
- Assignee: Kabushiki Kaisha Honda Lock
- Current Assignee: Kabushiki Kaisha Honda Lock
- Current Assignee Address: JP Miyazaki
- Agency: Arent Fox, LLP
- Priority: JP2008-092323 20080331
- International Application: PCT/JP2009/054509 WO 20090310
- International Announcement: WO2009/122866 WO 20091008
- Main IPC: B29C45/56
- IPC: B29C45/56
Abstract:
A resin-molding mold device is provided for carrying out the resin molding process to mold the resin molded article, wherein when cooling after charging a molten synthetic resin into a cavity (14) and maintaining the pressure, a movable core (11) is urged to the side in which the capacity of the cavity (14) is decreased. This enables a resin molded article having a proper shape to be reliably molded by preventing a design surface from parting from a cavity wall surface when die-molding the resin molded article by charging a molten synthetic resin into a cavity formed from a plurality of dies.
Public/Granted literature
- US20110001266A1 RESIN MOLDING PROCESS AND RESIN-MOLDING MOLD DEVICE Public/Granted day:2011-01-06
Information query
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