A support grid for filling material packings includes plate-shaped support strips which extend perpendicularly to an installation plane and are connected in a cruciform manner to spacer strips also extending perpendicularly to the installation plane. Contour strips which are provided with openings and are disposed at an angle and at a distance from one another, are placed in the direction of the spacer strips. The size of the openings as well as the distances are selected in such a way that supported filling material cannot penetrate. The maximum cross-section of the openings amounts to 90 percent. A method for mounting a support grid for filling material packings, is also provided.