Invention Grant
- Patent Title: Resin composite copper foil, printed wiring board, and production processes thereof
- Patent Title (中): 树脂复合铜箔，印刷线路板及其制造方法
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Application No.: US11657529Application Date: 2007-01-25
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Publication No.: US07989081B2Publication Date: 2011-08-02
- Inventor: Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
- Applicant: Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
- Applicant Address: JP Tokyo JP Kanagawa-ken
- Assignee: Mitsubishi Gas Chemical Company, Inc.,PI R&D Co., Ltd.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.,PI R&D Co., Ltd.
- Current Assignee Address: JP Tokyo JP Kanagawa-ken
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-016081 20060125; JP2006-065010 20060310
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B27/06 ; C23C18/54
Abstract:
A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
Public/Granted literature
- US20070172674A1 Resin composite copper foil, printed wiring board, and production processes thereof Public/Granted day:2007-07-26
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