Invention Grant
- Patent Title: Method for forming photoelectric composite board
- Patent Title (中): 光电复合板成型方法
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Application No.: US11875112Application Date: 2007-10-19
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Publication No.: US07989148B2Publication Date: 2011-08-02
- Inventor: Tooru Nakashiba , Hiroyuki Yagyu , Shinji Hashimoto , Yuuki Kasai
- Applicant: Tooru Nakashiba , Hiroyuki Yagyu , Shinji Hashimoto , Yuuki Kasai
- Applicant Address: JP Osaka
- Assignee: Panasonic Electric Works Co., Ltd.
- Current Assignee: Panasonic Electric Works Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G02B6/13
Abstract:
In a method for forming a photoelectric composite board (10) on which a photoelectric transducer (5) is mounted, photo-masks (111, 112, 113) which are used in processes to form the photoelectric composite board (10) are respectively disposed on the basis of a reference mark (33) previously formed on a metal thin film (101). In addition, openings (22) are formed on solder resist layers (8) by irradiating laser beams at positions defined on the basis of a reference point (4a) defined above a light deflector (4) formed on an end of a light guide (3).
Public/Granted literature
- US20090104565A1 METHOD FOR FORMING PHOTOELECTRIC COMPOSITE BOARD Public/Granted day:2009-04-23
Information query
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