Invention Grant
- Patent Title: Method for fabricating image sensor
- Patent Title (中): 图像传感器的制造方法
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Application No.: US12382729Application Date: 2009-03-23
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Publication No.: US07989245B2Publication Date: 2011-08-02
- Inventor: Han-Seob Cha
- Applicant: Han-Seob Cha
- Applicant Address: US DE Wilmington
- Assignee: Crosstek Capital, LLC
- Current Assignee: Crosstek Capital, LLC
- Current Assignee Address: US DE Wilmington
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR2005-0062301 20050711
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An image sensor includes a first conductivity type substrate with a trench formed in a predetermined portion thereof, a second conductivity type impurity region formed in the first conductivity type substrate below the trench and being a part of a photodiode, a second conductivity type first epitaxial layer filling the trench and being a part of the photodiode, and a first conductivity type second epitaxial layer formed over the second conductivity type first epitaxial layer.
Public/Granted literature
- US20090286345A1 Image sensor and method for fabricating the same Public/Granted day:2009-11-19
Information query
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