Invention Grant
US07989523B2 Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom
有权
脂环式二环氧化合物,包含该环氧化合物的环氧树脂组合物及其固化物
- Patent Title: Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom
- Patent Title (中): 脂环式二环氧化合物,包含该环氧化合物的环氧树脂组合物及其固化物
-
Application No.: US12305906Application Date: 2007-06-29
-
Publication No.: US07989523B2Publication Date: 2011-08-02
- Inventor: Atsushi Sato , Hideyuki Takai , Hisashi Maeshima , Kyuhei Kitao
- Applicant: Atsushi Sato , Hideyuki Takai , Hisashi Maeshima , Kyuhei Kitao
- Applicant Address: JP Osaka-Shi
- Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee Address: JP Osaka-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-187167 20060607; JP2007-118344 20070427
- International Application: PCT/JP2007/063109 WO 20070629
- International Announcement: WO2008/004504 WO 20080110
- Main IPC: C08G59/24
- IPC: C08G59/24 ; C08G59/22 ; C08G59/20 ; C08L63/00 ; C08L63/08 ; B32B27/38

Abstract:
Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3′,4′-diepoxybicyclohexyl compound represented by following Formula (1): wherein R1 to R18 each represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or a substituted or unsubstituted alkoxy group, in which the alicyclic diepoxy compound contains isomers of the 3,4,3′,4′-diepoxybicyclohexyl compound in a content of less than 20% based on the total of the 3,4,3′,4′-diepoxybicyclohexyl compound and the isomers thereof in terms of peak area ratio as determined by gas chromatography.
Public/Granted literature
- US20100249341A1 ALICYCLIC DIEPOXY COMPOUND, EPOXY RESIN COMPOSITION COMPRISING THE SAME, AND CURED ARTICLE THEREFROM Public/Granted day:2010-09-30
Information query
IPC分类: