Invention Grant
- Patent Title: Thermosensitive adhesive composition, method of manufacturing the same and thermosensitive adhesive material
- Patent Title (中): 热敏粘合剂组合物，其制造方法和热敏粘合剂材料
-
Application No.: US11598132Application Date: 2006-11-10
-
Publication No.: US07989529B2Publication Date: 2011-08-02
- Inventor: Takehito Yamaguchi , Hiroaki Matsui , Mitsunobu Morita , Takayuki Sasaki , Kunio Hayakawa
- Applicant: Takehito Yamaguchi , Hiroaki Matsui , Mitsunobu Morita , Takayuki Sasaki , Kunio Hayakawa
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- Priority: JP2005-333095 20051117
- Main IPC: B60C1/00
- IPC: B60C1/00 ; C08K5/00
Abstract:
A thermosensitive adhesive composition including a thermosensitive plastic resin, a dispersing agent, a solid plasticizing agent and a eutectic agent represented by the following chemical structure (1): wherein X1 and X2 independently represent any one of a hydrogen atom, a halogen atom and an alkyl group, p and q independently represent an integer of from 1 to 5.
Public/Granted literature
Information query
