Invention Grant
- Patent Title: Housing assembly for electronic device
- Patent Title (中): 电子设备外壳组件
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Application No.: US12141230Application Date: 2008-06-18
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Publication No.: US07989696B2Publication Date: 2011-08-02
- Inventor: Zheng Shi , Chih-Chiang Chang , Zhi Li , Xiang-Guo Zhao
- Applicant: Zheng Shi , Chih-Chiang Chang , Zhi Li , Xiang-Guo Zhao
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agent Steven M. Reiss
- Priority: CN200810300646 20080320
- Main IPC: H02G3/14
- IPC: H02G3/14
Abstract:
A housing assembly includes a main body, a protecting cover, a connecting rod, a first elastic element, and a second elastic element. The main body has a receiving groove. At least one interface is mounted on a bottom surface of the receiving groove. The first elastic element provides a force for driving a portion of the protecting cover away from the main body. The second elastic element provides a force for driving the connecting rod to move in the direction of pressing the connecting rod.
Public/Granted literature
- US20090237892A1 HOUSING ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2009-09-24
Information query
IPC分类:
