Invention Grant
- Patent Title: Multi-layer wiring board
- Patent Title (中): 多层接线板
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Application No.: US11974335Application Date: 2007-10-12
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Publication No.: US07989708B2Publication Date: 2011-08-02
- Inventor: Yoshifumi Takada
- Applicant: Yoshifumi Takada
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2003-421954 20031219
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.
Public/Granted literature
- US20080047744A1 Multi-layer wiring board Public/Granted day:2008-02-28
Information query
