Invention Grant
- Patent Title: Keypad assembly and electronic device using same
- Patent Title (中): 键盘组装及使用电子装置
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Application No.: US12610494Application Date: 2009-11-02
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Publication No.: US07989716B2Publication Date: 2011-08-02
- Inventor: Wang-Hung Yeh , Chung-Yu Liu
- Applicant: Wang-Hung Yeh , Chung-Yu Liu
- Applicant Address: TW Taoyuan County
- Assignee: Foxconn Communication Technology Corp.
- Current Assignee: Foxconn Communication Technology Corp.
- Current Assignee Address: TW Taoyuan County
- Agent Steven M. Reiss
- Priority: CN200910302989 20090605
- Main IPC: H01H9/26
- IPC: H01H9/26
Abstract:
A keypad assembly is used for an electronic device. The keypad assembly includes a support member, and a plurality of key strips. The support member defines a plurality of openings and a plurality of cantilever plates, each cantilever plate extending into a corresponding opening. The key strips are received in the openings. Each key strip defines a slot, and each cantilever plate is received in a slot. The cantilever plates provide force to extend one portion of the key strips from the receiving groove.
Public/Granted literature
- US20100307904A1 KEYPAD ASSEMBLY AND ELECTRONIC DEVICE USING SAME Public/Granted day:2010-12-09
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