Invention Grant
- Patent Title: Image sensor and method of fabricating the same
- Patent Title (中): 图像传感器及其制造方法
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Application No.: US12045331Application Date: 2008-03-10
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Publication No.: US07989858B2Publication Date: 2011-08-02
- Inventor: Tae Gyu Kim
- Applicant: Tae Gyu Kim
- Applicant Address: KR Seoul
- Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2007-0024917 20070314
- Main IPC: H01L31/062
- IPC: H01L31/062

Abstract:
Provided are an image sensor and a method of fabricating the same. The image sensor according to an embodiment includes a semiconductor substrate including a circuit region; a metal interconnection layer including a metal interconnection and an interlayer dielectric on the semiconductor substrate; a plurality of first pixel isolation layers on the interlayer dielectric, each of the first pixel isolation layers protruding above a top surface of the interlayer dielectric; and a light receiving portion between the first pixel isolation layers, the light receiving portion including protruding portions along sidewalls of the first pixel isolation layers.
Public/Granted literature
- US20080224250A1 Image Sensor and Method of Fabricating The Same Public/Granted day:2008-09-18
Information query
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