Example embodiments of the invention may provide for a multi-package system. The multi-package system may include a first package having a plurality of first organic dielectric layers, where the first package includes at least one first conductive layer positioned between two of the plurality of first organic dielectric layers, and where the at least one first conductive layer is circuitized to form at least one first passive device. The multi-package system may also include a second package having a plurality of second organic dielectric layers, where the second package includes at least one second conductive layer positioned between two of the plurality of second organic dielectric layers, and where the at least one second conductive layer is circuitized to form at least one second passive device. An electrical connector may be provided between a bottom surface of the first package and a top surface of the second package to electrically connect the first package and the second package.