Invention Grant
- Patent Title: Direct-connect signaling system
- Patent Title (中): 直连信号系统
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Application No.: US11930217Application Date: 2007-10-31
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Publication No.: US07989929B2Publication Date: 2011-08-02
- Inventor: Joseph C. Fjelstad , Para K. Segaram , Belgacem Haba
- Applicant: Joseph C. Fjelstad , Para K. Segaram , Belgacem Haba
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
Public/Granted literature
- US20090108416A1 DIRECT-CONNECT SIGNALING SYSTEM Public/Granted day:2009-04-30
Information query
IPC分类:
