Microelectronic device with integrated energy source

Invention Grant

US07989936B2 Microelectronic device with integrated energy source 有权

Title translation: 具有集成能源的微电子器件

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Patent Title: Microelectronic device with integrated energy source
Patent Title (中): 具有集成能源的微电子器件
Application No.: US12467703

Application Date: 2009-05-18
Publication No.: US07989936B2

Publication Date: 2011-08-02
Inventor: Joseph Harry McCain
Applicant: Joseph Harry McCain
Main IPC: H01L23/02
IPC: H01L23/02

Microelectronic device with integrated energy source

Abstract:

An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an antenna, an energy supply and an integrated circuit chip. The integrated circuit chip is electrically coupled to the antenna and the energy supply. A material substantially encloses the electronic device.

Abstract(Chinese):

一种包括具有多个基本上配置的部件的电子设备的装置，所述多个部件包括天线，能量供应和集成电路芯片。集成电路芯片电耦合到天线和能量供应。材料基本上包围电子设备。

Public/Granted literature

US20090221925A1 Microelectronic Device With Integrated Energy Source Public/Granted day:2009-09-03

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）