Invention Grant
US07989940B2 System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
有权
用于通过孔通过相同尺寸的封装的线接合堆叠来增加球栅格封装上的IO数量的系统和方法
- Patent Title: System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
- Patent Title (中): 用于通过孔通过相同尺寸的封装的线接合堆叠来增加球栅格封装上的IO数量的系统和方法
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Application No.: US11014506Application Date: 2004-12-15
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Publication No.: US07989940B2Publication Date: 2011-08-02
- Inventor: Belgacem Haba , Masud Beroz
- Applicant: Belgacem Haba , Masud Beroz
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/02
- IPC: H01L23/02

Abstract:
A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, JEDEC ball out, and die exposure. The polymeric tape layers have surface circuits (e.g., leads, pads, and wiring) located on the surface.
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