Invention Grant
US07989945B2 Spring connector for making electrical contact at semiconductor scales
有权
用于在半导体尺度进行电接触的弹簧连接器
- Patent Title: Spring connector for making electrical contact at semiconductor scales
- Patent Title (中): 用于在半导体尺度进行电接触的弹簧连接器
-
Application No.: US11706100Application Date: 2007-02-14
-
Publication No.: US07989945B2Publication Date: 2011-08-02
- Inventor: John David Williams , Eric Michael Radza
- Applicant: John David Williams , Eric Michael Radza
- Applicant Address: US CA Sunnyvale
- Assignee: Neoconix, Inc.
- Current Assignee: Neoconix, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Kenneth A. Seaman
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H05K7/10 ; H05K1/00
Abstract:
A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
Public/Granted literature
- US20070275572A1 Connector for making electrical contact at semiconductor scales Public/Granted day:2007-11-29
Information query
IPC分类:
