Invention Grant
- Patent Title: Die assemblies
- Patent Title (中): 模组件
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Application No.: US12704941Application Date: 2010-02-12
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Publication No.: US07989951B2Publication Date: 2011-08-02
- Inventor: Betty H. Yeung , David J. Dougherty
- Applicant: Betty H. Yeung , David J. Dougherty
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L23/12
- IPC: H01L23/12

Abstract:
An embodiment of a die assembly includes a flange, lip walls, and leads for electrical contact with one or more die mounted on the flange. The flange has first and second opposed flange surfaces and flange sidewalls extending between the surfaces. The lip walls have first and second opposed lip surfaces and lip sidewalls extending between the first and second lip surfaces. The lip sidewalls are positioned adjacent to the flange sidewalls. The leads, which have inboard end portions and outboard end portions, are configured to preserve a seating plane. The seating plane is spaced apart from a plane of the second flange surface. The inboard end portions of the leads are embedded in the lip walls, and extend from the seating plane upward through the lip walls toward the first lip surfaces. The outboard end portions are aligned substantially within the seating plane.
Public/Granted literature
- US20100142168A1 DIE ASSEMBLIES Public/Granted day:2010-06-10
Information query
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