Invention Grant
- Patent Title: Redistribution layer enhancement to improve reliability of wafer level packaging
-
Application No.: US12616077Application Date: 2009-11-10
-
Publication No.: US07989961B2Publication Date: 2011-08-02
- Inventor: S. Kaysar Rahim , Tiao Zhou , Arkadii Samoilov , Viren Khandekar , Yong Li Xu
- Applicant: S. Kaysar Rahim , Tiao Zhou , Arkadii Samoilov , Viren Khandekar , Yong Li Xu
- Applicant Address: US CA Sunnyvale
- Assignee: Maxim Integrated Products, Inc.
- Current Assignee: Maxim Integrated Products, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Howison & Arnott, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
Public/Granted literature
- US08084871B2 Redistribution layer enhancement to improve reliability of wafer level packaging Public/Granted day:2011-12-27
Information query
IPC分类:
